3D stacked imager and digital coupling noise

Authors

  • Fernando Raymundo Luyo

DOI:

https://doi.org/10.31381/perfiles_ingenieria.v14i14.2370

Abstract

Los circuitos de alta integración como un generador de imágenes pueden cambiar su implementación de silicio o la topología de diseño mediante la tecnología de integración 3D. Además, esta tecnología puede permitir la integración de circuitos digitales a nivel de píxeles. Esta integración puede afectar las señales sensibles del sensor de imagen y no son fáciles de estimar. Este estudio se enfoca en un método aproximado para calcular el impacto de agregar digital en el píxel en una cámara de imágenes apiladas en 3D (ruido de acoplamiento digital).

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Published

2019-10-14

How to Cite

Raymundo Luyo, F. (2019). 3D stacked imager and digital coupling noise. Engineering Profiles, 14(14), 41–48. https://doi.org/10.31381/perfiles_ingenieria.v14i14.2370

Issue

Vol. 14 No. 14 (2018): Perfiles de Ingeniería

Section

Artículos Originales

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